Heat treatment method for growing silicide

ABSTRACT

Ions of silicon are implanted into source/drain regions in a semiconductor wafer to amorphize an ion implantation region in the semiconductor wafer. A nickel film is deposited on the amorphized ion implantation region. First irradiation from a flash lamp is performed on the semiconductor wafer with the nickel film deposited thereon to increase the temperature of a front surface of the semiconductor wafer from a preheating temperature to a target temperature for a time period in the range of 1 to 20 milliseconds. Subsequently, second irradiation from the flash lamp is performed to maintain the temperature of the front surface of the semiconductor wafer within a ±25° C. range around the target temperature for a time period in the range of 1 to 100 milliseconds. This causes nickel silicide to grow preferentially in a direction perpendicular to the semiconductor wafer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat treatment method whichirradiates a silicon substrate such as a semiconductor wafer with lightto heat the substrate, thereby growing a silicide.

2. Description of the Background Art

Silicide technology that forms compounds (silicides) of silicon withmetals for the purpose of increasing the performance of field-effecttransistors (FETs) has been known. The formation of silicides reducesresistances in gates and source/drain regions to achieve the high-speedoperation of the field-effect transistors. Examples of the metals thatform silicides which are under study include nickel (Ni), cobalt (Co),and titanium (Ti). In particular, nickel is promising as the mostsuitable material for finer geometries. Japanese Patent ApplicationLaid-Open No. 2011-14567 discloses a technique in which a nickel film isdeposited on a silicon layer and heat treatment is performed using anelectric furnace or a lamp annealer to form nickel silicide.

Conventionally, the heat treatment for the formation of nickel siliciderequires treatment time in the range of tens of seconds to 100 minutesor more. In the silicide technology, for example, disclosed in JapanesePatent Application Laid-Open No. 2011-14567, the heat treatment time isnot less than 15 minutes and is less than 120 minutes when the electricfurnace is used, and the heat treatment time is not less than 15 secondsand is not more than 5 minutes when the lamp annealer is used.

However, when the heat treatment is performed for such a long time, thenickel silicide abnormally grows laterally (in a direction from thesource/drain regions to the gate) to break through source/drainjunctions, thereby giving rise to a problem in that leakage currentincreases rapidly.

SUMMARY OF THE INVENTION

The present invention is intended for a method of heating a substrate ofsilicon to grow a silicide.

According to an aspect of the present invention, the method comprisesthe steps of: (a) implanting ions into the substrate to amorphize an ionimplantation region in the substrate; (b) depositing a metal film on theamorphized ion implantation region; (c) heating the substrate with themetal film formed thereon at a predetermined preheating temperature; (d)irradiating the substrate with light to increase the temperature of afront surface of the substrate from the preheating temperature to atarget temperature for a time period in the range of 1 to 20milliseconds; and (e) irradiating the substrate with light to maintainthe temperature of the front surface of the substrate within a ±25° C.range around the target temperature for a time period in the range of 1to 100 milliseconds, the step (e) being performed after the step (d).

The silicide grows preferentially in a direction perpendicular to thesubstrate. The formation of the silicide is achieved while the abnormallateral growth of the silicide is prevented. Also, point defectsintroduced in the ion implantation step are reduced.

Preferably, a switching element intermittently supplies electricalcharges from a capacitor to a flash lamp to control an emission outputfrom the flash lamp in the step (d) and in the step (e).

The temperature of the front surface of the substrate is maintained nearthe target temperature with stability.

It is therefore an object of the present invention to form a silicidewhile preventing the abnormal lateral growth of the silicide.

These and other objects, features, aspects and advantages of the presentinvention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a longitudinal sectional view showing a configuration of aheat treatment apparatus;

FIG. 2 is a perspective view showing the entire external appearance of aholder;

FIG. 3 is a top plan view of the holder;

FIG. 4 is a side view of the holder as seen from one side;

FIG. 5 is a plan view of a transfer mechanism;

FIG. 6 is a side view of the transfer mechanism;

FIG. 7 is a plan view showing an arrangement of halogen lamps;

FIG. 8 is a diagram showing a driving circuit for a flash lamp;

FIG. 9 is a flow diagram showing a treatment procedure for formingnickel silicide in a semiconductor wafer;

FIG. 10 is a view illustrating an amorphization process performed by ionimplantation;

FIG. 11 is a view showing a nickel film deposited on an ion implantationregion;

FIG. 12 is a view showing the growth of nickel silicide;

FIG. 13 is a graph showing changes in the temperature of the frontsurface of a semiconductor wafer;

FIG. 14 is a graph showing an example of a correlation between thewaveform of a pulse signal and a current flowing through a flash lamp;

FIG. 15 is a graph showing an example of an emission output profile of aflash lamp; and

FIG. 16 is a graph showing an example of a temperature profile of thefront surface of a semiconductor wafer.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A preferred embodiment according to the present invention will now bedescribed in detail with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing a configuration of aheat treatment apparatus 1 for carrying out a heat treatment methodaccording to the present invention. The heat treatment apparatus 1according to the present preferred embodiment is a flash lamp annealerfor irradiating a disk-shaped semiconductor wafer W having a diameter of300 mm and serving as a substrate with a flash of light to heat thesemiconductor wafer W. A semiconductor wafer W prior to the transportinto the heat treatment apparatus 1 includes a nickel film depositedthereon, and the heat treatment apparatus 1 performs a heating treatmenton the semiconductor wafer W to thereby form nickel silicide, which willbe described in detail later.

The heat treatment apparatus 1 includes a chamber 6 for receiving asemiconductor wafer W therein, a flash heating part 5 including aplurality of built-in flash lamps FL, a halogen heating part 4 includinga plurality of built-in halogen lamps HL, and a shutter mechanism 2. Theflash heating part 5 is provided over the chamber 6, and the halogenheating part 4 is provided under the chamber 6. The heat treatmentapparatus 1 further includes a holder 7 provided inside the chamber 6and for holding a semiconductor wafer W in a horizontal position, and atransfer mechanism 10 provided inside the chamber 6 and for transferringa semiconductor wafer W between the holder 7 and the outside of the heattreatment apparatus 1. The heat treatment apparatus 1 further includes acontroller 3 for controlling operating mechanisms provided in theshutter mechanism 2, the halogen heating part 4, the flash heating part5, and the chamber 6 to cause the operating mechanisms to heat-treat asemiconductor wafer W.

The chamber 6 is configured such that upper and lower chamber windows 63and 64 made of quartz are mounted to the top and bottom, respectively,of a tubular chamber side portion 61. The chamber side portion 61 has agenerally tubular shape having an open top and an open bottom. The upperchamber window 63 is mounted to block the top opening of the chamberside portion 61, and the lower chamber window 64 is mounted to block thebottom opening thereof. The upper chamber window 63 forming the ceilingof the chamber 6 is a disk-shaped member made of quartz, and serves as aquartz window that transmits a flash of light emitted from the flashheating part 5 therethrough into the chamber 6. The lower chamber window64 forming the floor of the chamber 6 is also a disk-shaped member madeof quartz, and serves as a quartz window that transmits light emittedfrom the halogen heating part 4 therethrough into the chamber 6.

An upper reflective ring 68 is mounted to an upper portion of the innerwall surface of the chamber side portion 61, and a lower reflective ring69 is mounted to a lower portion thereof. Both of the upper and lowerreflective rings 68 and 69 are in the form of an annular ring. The upperreflective ring 68 is mounted by being inserted downwardly from the topof the chamber side portion 61. The lower reflective ring 69, on theother hand, is mounted by being inserted upwardly from the bottom of thechamber side portion 61 and fastened with screws not shown. In otherwords, the upper and lower reflective rings 68 and 69 are removablymounted to the chamber side portion 61. An interior space of the chamber6, i.e. a space surrounded by the upper chamber window 63, the lowerchamber window 64, the chamber side portion 61, and the upper and lowerreflective rings 68 and 69, is defined as a heat treatment space 65.

A recessed portion 62 is defined in the inner wall surface of thechamber 6 by mounting the upper and lower reflective rings 68 and 69 tothe chamber side portion 61. Specifically, the recessed portion 62 isdefined which is surrounded by a middle portion of the inner wallsurface of the chamber side portion 61 where the reflective rings 68 and69 are not mounted, a lower end surface of the upper reflective ring 68,and an upper end surface of the lower reflective ring 69. The recessedportion 62 is provided in the form of a horizontal annular ring in theinner wall surface of the chamber 6, and surrounds the holder 7 whichholds a semiconductor wafer W.

The chamber side portion 61, and the upper and lower reflective rings 68and 69 are made of a metal material (e.g., stainless steel) with highstrength and high heat resistance. The inner peripheral surfaces of theupper and lower reflective rings 68 and 69 are provided as mirrorsurfaces by electrolytic nickel plating.

The chamber side portion 61 is provided with a transport opening(throat) 66 for the transport of a semiconductor wafer W therethroughinto and out of the chamber 6. The transport opening 66 is openable andclosable by a gate valve 185. The transport opening 66 is connected incommunication with an outer peripheral surface of the recessed portion62. Thus, when the transport opening 66 is opened by the gate valve 185,a semiconductor wafer W is allowed to be transported through thetransport opening 66 and the recessed portion 62 into and out of theheat treatment space 65. When the transport opening 66 is closed by thegate valve 185, the heat treatment space 65 in the chamber 6 is anenclosed space.

At least one gas supply opening 81 for supplying a treatment gas (inthis preferred embodiment, nitrogen (N₂) gas) therethrough into the heattreatment space 65 is provided in an upper portion of the inner wall ofthe chamber 6. The gas supply opening 81 is provided above the recessedportion 62, and may be provided in the upper reflective ring 68. The gassupply opening 81 is connected in communication with a gas supply pipe83 through a buffer space 82 provided in the form of an annular ringinside the side wall of the chamber 6. The gas supply pipe 83 isconnected to a nitrogen gas supply source 85. A valve 84 is inserted atsome midpoint in the gas supply pipe 83. When the valve 84 is opened,nitrogen gas is fed from the nitrogen gas supply source 85 to the bufferspace 82. The nitrogen gas flowing in the buffer space 82 flows in aspreading manner within the buffer space 82 which is lower in fluidresistance than the gas supply opening 81, and is supplied through thegas supply opening 81 into the heat treatment space 65.

On the other hand, at least one gas exhaust opening 86 for exhausting agas from the heat treatment space 65 is provided in a lower portion ofthe inner wall of the chamber 6. The gas exhaust opening 86 is providedbelow the recessed portion 62, and may be provided in the lowerreflective ring 69. The gas exhaust opening 86 is connected incommunication with a gas exhaust pipe 88 through a buffer space 87provided in the form of an annular ring inside the side wall of thechamber 6. The gas exhaust pipe 88 is connected to an exhaust part 190.A valve 89 is inserted at some midpoint in the gas exhaust pipe 88. Whenthe valve 89 is opened, the gas in the heat treatment space 65 isexhausted through the gas exhaust opening 86 and the buffer space 87 tothe gas exhaust pipe 88. The at least one gas supply opening 81 and theat least one gas exhaust opening 86 may include a plurality of gassupply openings 81 and a plurality of gas exhaust openings 86,respectively, arranged in a circumferential direction of the chamber 6,and may be in the form of slits. The nitrogen gas supply source 85 andthe exhaust part 190 may be mechanisms provided in the heat treatmentapparatus 1 or be utility systems in a factory in which the heattreatment apparatus 1 is installed.

A gas exhaust pipe 191 for exhausting the gas from the heat treatmentspace 65 is also connected to a distal end of the transport opening 66.The gas exhaust pipe 191 is connected through a valve 192 to the exhaustpart 190. By opening the valve 192, the gas in the chamber 6 isexhausted through the transport opening 66.

FIG. 2 is a perspective view showing the entire external appearance ofthe holder 7. FIG. 3 is a top plan view of the holder 7. FIG. 4 is aside view of the holder 7 as seen from one side. The holder 7 includes abase ring 71, coupling portions 72, and a susceptor 74. The base ring71, the coupling portions 72, and the susceptor 74 are all made ofquartz. In other words, the whole of the holder 7 is made of quartz.

The base ring 71 is a quartz member in the form of an annular ring. Thebase ring 71 is supported by the wall surface of the chamber 6 by beingplaced on the bottom surface of the recessed portion 62 (with referenceto FIG. 1). The multiple coupling portions 72 (in this preferredembodiment, four coupling portions 72) are mounted upright on the uppersurface of the base ring 71 in the form of the annular ring and arrangedin a circumferential direction of the base ring 71. The couplingportions 72 are quartz members, and are rigidly secured to the base ring71 by welding. The base ring 71 may be of an arcuate shape such that aportion is removed from the annular ring.

The planar susceptor 74 is supported by the four coupling portions 72provided on the base ring 71. The susceptor 74 is a generally circularplanar member made of quartz. The diameter of the susceptor 74 isgreater than that of a semiconductor wafer W. In other words, thesusceptor 74 has a size, as seen in plan view, greater than that of thesemiconductor wafer W. Multiple (in this preferred embodiment, five)guide pins 76 are mounted upright on the upper surface of the susceptor74. The five guide pins 76 are disposed along the circumference of acircle concentric with the outer circumference of the susceptor 74. Thediameter of a circle on which the five guide pins 76 are disposed isslightly greater than the diameter of the semiconductor wafer W. Theguide pins 76 are also made of quartz. The guide pins 76 may be machinedfrom a quartz ingot integrally with the susceptor 74. Alternatively, theguide pins 76 separately machined may be attached to the susceptor 74 bywelding and the like.

The four coupling portions 72 provided upright on the base ring 71 andthe lower surface of a peripheral portion of the susceptor 74 arerigidly secured to each other by welding. In other words, the susceptor74 and the base ring 71 are fixedly coupled to each other with thecoupling portions 72, and the holder 7 is an integrally formed membermade of quartz. The base ring 71 of such a holder 7 is supported by thewall surface of the chamber 6, whereby the holder 7 is mounted to thechamber 6. With the holder 7 mounted to the chamber 6, the susceptor 74of a generally disc-shaped configuration assumes a horizontal position(a position such that the normal to the susceptor 74 coincides with avertical direction). A semiconductor wafer W transported into thechamber 6 is placed and held in a horizontal position on the susceptor74 of the holder 7 mounted to the chamber 6. The semiconductor wafer Wis placed inside the circle defined by the five guide pins 76. Thisprevents the horizontal misregistration of the semiconductor wafer W.The number of guide pins 76 is not limited to five, but may bedetermined so as to prevent the misregistration of the semiconductorwafer W.

As shown in FIGS. 2 and 3, an opening 78 and a notch 77 are provided inthe susceptor 74 so as to extend vertically through the susceptor 74.The notch 77 is provided to allow a distal end portion of a probe of acontact-type thermometer 130 including a thermocouple to passtherethrough. The opening 78, on the other hand, is provided for aradiation thermometer 120 to receive radiation (infrared radiation)emitted from the lower surface of the semiconductor wafer W held by thesusceptor 74. The susceptor 74 further includes four through holes 79bored therein and designed so that lift pins 12 of the transfermechanism 10 to be described later pass through the through holes 79,respectively, to transfer a semiconductor wafer W.

FIG. 5 is a plan view of the transfer mechanism 10. FIG. 6 is a sideview of the transfer mechanism 10. The transfer mechanism 10 includes apair of transfer arms 11. The transfer arms 11 are of an arcuateconfiguration extending substantially along the annular recessed portion62. Each of the transfer arms 11 includes the two lift pins 12 mountedupright thereon. The transfer arms 11 are pivotable by a horizontalmovement mechanism 13. The horizontal movement mechanism 13 moves thepair of transfer arms 11 horizontally between a transfer operationposition (a position indicated by solid lines in FIG. 5) in which asemiconductor wafer W is transferred to and from the holder 7 and aretracted position (a position indicated by dash-double-dot lines inFIG. 5) in which the transfer arms 11 do not overlap the semiconductorwafer W held by the holder 7 as seen in plan view. The horizontalmovement mechanism 13 may be of the type which causes individual motorsto pivot the transfer arms 11 respectively or of the type which uses alinkage mechanism to cause a single motor to pivot the pair of transferarms 11 in cooperative relation.

The transfer arms 11 are moved upwardly and downwardly together with thehorizontal movement mechanism 13 by an elevating mechanism 14. As theelevating mechanism 14 moves up the pair of transfer arms 11 in theirtransfer operation position, the four lift pins 12 in total pass throughthe respective four through holes 79 (with reference to FIGS. 2 and 3)bored in the susceptor 74 so that the upper ends of the lift pins 12protrude from the upper surface of the susceptor 74. On the other hand,as the elevating mechanism 14 moves down the pair of transfer arms 11 intheir transfer operation position to take the lift pins 12 out of therespective through holes 79 and the horizontal movement mechanism 13moves the pair of transfer arms 11 so as to open the transfer arms 11,the transfer arms 11 move to their retracted position. The retractedposition of the pair of transfer arms 11 is immediately over the basering 71 of the holder 7. The retracted position of the transfer arms 11is inside the recessed portion 62 because the base ring 71 is placed onthe bottom surface of the recessed portion 62. An exhaust mechanism notshown is also provided near the location where the drivers (thehorizontal movement mechanism 13 and the elevating mechanism 14) of thetransfer mechanism 10 are provided, and is configured to exhaust anatmosphere around the drivers of the transfer mechanism 10 to theoutside of the chamber 6.

Referring again to FIG. 1, the flash heating part 5 provided over thechamber 6 includes an enclosure 51, a light source provided inside theenclosure 51 and including the multiple (in this preferred embodiment,30) xenon flash lamps FL, and a reflector 52 provided inside theenclosure 51 so as to cover the light source from above. The flashheating part 5 further includes a lamp light radiation window 53 mountedto the bottom of the enclosure 51. The lamp light radiation window 53forming the floor portion of the flash heating part 5 is a plate-likequartz window made of quartz. The flash heating part 5 is provided overthe chamber 6, whereby the lamp light radiation window 53 is opposed tothe upper chamber window 63. The flash lamps FL direct a flash of lightfrom over the chamber 6 through the lamp light radiation window 53 andthe upper chamber window 63 toward the heat treatment space 65.

The flash lamps FL, each of which is a rod-shaped lamp having anelongated cylindrical shape, are arranged in a plane so that thelongitudinal directions of the respective flash lamps FL are in parallelwith each other along the main surface of a semiconductor wafer W heldby the holder 7 (that is, in a horizontal direction). Thus, a planedefined by the arrangement of the flash lamps FL is also a horizontalplane.

FIG. 8 is a diagram showing a driving circuit for each flash lamp FL. Asillustrated in FIG. 8, a capacitor 93, a coil 94, a flash lamp FL, andan IGBT (insulated-gate bipolar transistor) 96 are connected in series.Also as shown in FIG. 8, the controller 3 includes a pulse generator 31and a waveform setting part 32, and is connected to an input part 33.Examples of the input part 33 used herein include various known inputdevices such as a keyboard, a mouse, and a touch panel. The waveformsetting part 32 sets the waveform of a pulse signal, based on an inputfrom the input part 33, and the pulse generator 31 generates the pulsesignal in accordance with that waveform.

The flash lamp FL includes a rod-shaped glass tube (discharge tube) 92containing xenon gas sealed therein and having positive and negativeelectrodes provided on opposite ends thereof, and a trigger electrode 91attached to the outer peripheral surface of the glass tube 92. A powersupply unit 95 applies a predetermined voltage to the capacitor 93, andthe capacitor 93 is charged in accordance with the applied voltage(charging voltage). A trigger circuit 97 is capable of applying a highvoltage to the trigger electrode 91. The timing of the voltageapplication from the trigger circuit 97 to the trigger electrode 91 isunder the control of the controller 3.

The IGBT 96 is a bipolar transistor which includes a MOSFET(metal-oxide-semiconductor field-effect transistor) incorporated in thegate thereof, and is also a switching element suitable for handling alarge amount of power. The pulse generator 31 in the controller 3applies the pulse signal to the gate of the IGBT 96. When a voltage(“high” voltage) not less than a predetermined level is applied to thegate of the IGBT 96, the IGBT 96 turns on. When a voltage (“low”voltage) less than the predetermined level is applied to the gate of theIGBT 96, the IGBT 96 turns off. In this manner, the driving circuitincluding the flash lamp FL is turned on and off by the IGBT 96. Byturning the IGBT 96 on and off, a connection between the flash lamp FLand the capacitor 93 corresponding thereto is made and broken.

Even if, with the capacitor 93 in the charged state, the IGBT 96 turnson to apply a high voltage across the electrodes of the glass tube 92,no electricity will flow through the glass tube 92 in a normal statebecause the xenon gas is electrically insulative. However, when thetrigger circuit 97 applies a high voltage to the trigger electrode 91 toproduce an electrical breakdown, an electrical discharge between theelectrodes causes a current to flow momentarily in the glass tube 92, sothat xenon atoms or molecules are excited at this time to cause lightemission.

Also, the reflector 52 shown in FIG. 1 is provided over the plurality offlash lamps FL so as to cover all of the flash lamps FL. A fundamentalfunction of the reflector 52 is to reflect the light emitted from theplurality of flash lamps FL toward the holder 7. The reflector 52 is aplate made of an aluminum alloy. A surface of the reflector 52 (asurface which faces the flash lamps FL) is roughened by abrasiveblasting to produce a satin finish thereon.

The multiple (in this preferred embodiment, 40) halogen lamps HL areincorporated in the halogen heating part 4 provided under the chamber 6.The halogen lamps HL direct light from under the chamber 6 through thelower chamber window 64 toward the heat treatment space 65. FIG. 7 is aplan view showing an arrangement of the multiple halogen lamps HL. Inthis preferred embodiment, 20 halogen lamps HL are arranged in an uppertier, and 20 halogen lamps HL are arranged in a lower tier. Each of thehalogen lamps HL is a rod-shaped lamp having an elongated cylindricalshape. The 20 halogen lamps HL in the upper tier and the 20 halogenlamps HL in the lower tier are arranged so that the longitudinaldirections thereof are in parallel with each other along a main surfaceof a semiconductor wafer W held by the holder 7 (that is, in ahorizontal direction). Thus, a plane defined by the arrangement of thehalogen lamps HL in each of the upper and lower tiers is also ahorizontal plane.

As shown in FIG. 7, the halogen lamps HL in each of the upper and lowertiers are disposed at a higher density in a region opposed to theperipheral portion of the semiconductor wafer W held by the holder 7than in a region opposed to the central portion thereof. In other words,the halogen lamps HL in each of the upper and lower tiers are arrangedat shorter intervals in the peripheral portion of the lamp arrangementthan in the central portion thereof. This allows a greater amount oflight to impinge upon the peripheral portion of the semiconductor waferW where a temperature decrease is prone to occur when the semiconductorwafer W is heated by the irradiation thereof with light from the halogenheating part 4.

The group of halogen lamps HL in the upper tier and the group of halogenlamps HL in the lower tier are arranged to intersect each other in alattice pattern. In other words, the 40 halogen lamps HL in total aredisposed so that the longitudinal direction of the halogen lamps HL inthe upper tier and the longitudinal direction of the halogen lamps HL inthe lower tier are orthogonal to each other.

Each of the halogen lamps HL is a filament-type light source whichpasses current through a filament disposed in a glass tube to make thefilament incandescent, thereby emitting light. A gas prepared byintroducing a halogen element (iodine, bromine and the like) in traceamounts into an inert gas such as nitrogen, argon and the like is sealedin the glass tube. The introduction of the halogen element allows thetemperature of the filament to be set at a high temperature whilesuppressing a break in the filament. Thus, the halogen lamps HL have theproperties of having a longer life than typical incandescent lamps andbeing capable of continuously emitting intense light. In addition, thehalogen lamps HL, which are rod-shaped lamps, have a long life. Thearrangement of the halogen lamps HL in a horizontal direction providesgood efficiency of radiation toward the semiconductor wafer W providedover the halogen lamps HL.

Also as shown in FIG. 1, the heat treatment apparatus 1 includes theshutter mechanism 2 provided alongside the halogen heating part 4 andthe chamber 6. The shutter mechanism 2 includes a shutter plate 21, anda sliding drive mechanism 22. The shutter plate 21 is a plate opaque tohalogen light (light from a halogen light source), and is made oftitanium (Ti), for example. The sliding drive mechanism 22 causes theshutter plate 21 to slidably move in a horizontal direction, therebybringing the shutter plate 21 into and out of a light shielding positionlying between the halogen heating part 4 and the holder 7. When thesliding drive mechanism 22 moves the shutter plate 21 forward, theshutter plate 21 is inserted into the light shielding position (aposition indicated by dash-double-dot lines in FIG. 1) lying between thechamber 6 and the halogen heating part 4 to provide isolation betweenthe lower chamber window 64 and the plurality of halogen lamps HL. Thus,light directed from the plurality of halogen lamps HL toward the holder7 in the heat treatment space 65 is intercepted. On the other hand, whenthe sliding drive mechanism 22 moves the shutter plate 21 backward, theshutter plate 21 is retracted from the light shielding position lyingbetween the chamber 6 and the halogen heating part 4 to open the spacelying under the lower chamber window 64.

The controller 3 controls the aforementioned various operatingmechanisms provided in the heat treatment apparatus 1. The controller 3is similar in hardware configuration to a typical computer.Specifically, the controller 3 includes a CPU for performing variouscomputation processes, a ROM or read-only memory for storing a basicprogram therein, a RAM or readable/writable memory for storing variouspieces of information therein, and a magnetic disk for storing controlsoftware, data and the like therein. The CPU in the controller 3executes a predetermined processing program, whereby the processes inthe heat treatment apparatus 1 proceed. Also, as shown in FIG. 8, thecontroller 3 includes the pulse generator 31 and the waveform settingpart 32. As mentioned earlier, the waveform setting part 32 sets thewaveform of the pulse signal, based on an input from the input part 33,and the pulse generator 31 outputs the pulse signal to the gate of theIGBT 96 in accordance with the waveform. The controller 3 and the IGBT96 constitute a light emission controller for controlling an emissionoutput from each flash lamp FL.

The heat treatment apparatus 1 further includes, in addition to theaforementioned components, various cooling structures to prevent anexcessive temperature rise in the halogen heating part 4, the flashheating part 5 and the chamber 6 because of the heat energy generatedfrom the halogen lamps HL and the flash lamps FL during the heattreatment of a semiconductor wafer W. As an example, a water coolingtube (not shown) is provided in the walls of the chamber 6. Also, thehalogen heating part 4 and the flash heating part 5 have an air coolingstructure for forming a gas flow therein to exhaust heat. Air issupplied to a gap between the upper chamber window 63 and the lamp lightradiation window 53 to cool down the flash heating part 5 and the upperchamber window 63.

Next, a treatment procedure for forming nickel silicide in asemiconductor wafer W will be described. FIG. 9 is a flow diagramshowing a treatment procedure for forming nickel silicide in asemiconductor wafer W. Processes in Step S3 and its subsequent steps inFIG. 9 are those performed by the heat treatment apparatus 1. First,ions are implanted into a semiconductor wafer W to amorphize an ionimplantation region in the semiconductor wafer W (in Step S1).

FIG. 10 is a view illustrating an amorphization process performed by ionimplantation. The semiconductor wafer W prior to the amorphizationprocess is configured such that a gate electrode 115 is provided over anupper surface of a base material 111 of monocrystalline silicon. Thegate electrode 115 made of metal is provided on a gate insulator film114 which in turn is provided on the base material 111 made of silicon.Side walls 116 made of SiN are formed on the sides of the gate electrode115. Parts of the base material 111 made of silicon which lie in theupper surface thereof on opposite sides of the gate electrode 115 serveas source/drain regions. In Step S1, ions of one element selected fromthe group consisting of nitrogen (N), argon (Ar), silicon (Si) andgermanium (Ge) are implanted into the source/drain regions, as indicatedby arrows AR10 in FIG. 10. The ion implantation may be performed using aknown ion implantation apparatus.

The implantation of the ions causes an ion implantation region 150 whichhas been crystalline to be amorphized, thereby forming amorphoussilicon. A boundary between amorphous silicon and crystalline silicon isindicated by a dotted line in FIG. 10. As shown in FIG. 10, pointdefects 155 known as EOR (end-of-range) defects are formed in some casesnear the boundary between amorphous silicon and crystalline silicon(immediately under the amorphous layer).

Next, a nickel film 158 is deposited on the amorphized ion implantationregion 150 (in Step S2). FIG. 11 is a view showing the nickel film 158deposited on the ion implantation region 150. The material of the nickelfilm 158 deposited in Step S2 is an alloy of nickel (Ni) containingplatinum (Pt), cobalt (Co) and titanium (Ti). The nickel film 158 may bedeposited by sputtering using a known sputtering apparatus, for example.Alternatively, the nickel film 158 may be deposited by vacuumevaporation. In FIG. 11, the thickness of the nickel film 158 is shownas exaggerated for ease of understanding. In actuality, the thickness ofthe nickel film 158 is on the order of several to a dozen or sonanometers.

After the completion of the deposition process in Step S2 and itspreceding step, the semiconductor wafer W with the nickel film 158deposited on the amorphized ion implantation region 150 is transportedinto the aforementioned heat treatment apparatus 1 (in Step S3). Theprocedure for the operation in the heat treatment apparatus 1 which willbe described below proceeds under the control of the controller 3 overthe operating mechanisms of the heat treatment apparatus 1.

Prior to the transport of the semiconductor wafer W into the heattreatment apparatus 1, the valve 84 is opened for supply of gas, and thevalves 89 and 192 for exhaust of gas are opened, so that the supply andexhaust of gas into and out of the chamber 6 is started in the heattreatment apparatus 1. When the valve 84 is opened, nitrogen gas issupplied through the gas supply opening 81 into the heat treatment space65. When the valve 89 is opened, the gas within the chamber 6 isexhausted through the gas exhaust opening 86. This causes the nitrogengas supplied from an upper portion of the heat treatment space 65 in thechamber 6 to flow downwardly and then to be exhausted from a lowerportion of the heat treatment space 65.

The gas within the chamber 6 is exhausted also through the transportopening 66 by opening the valve 192. Further, the exhaust mechanism notshown exhausts an atmosphere near the drivers of the transfer mechanism10. It should be noted that the nitrogen gas is continuously suppliedinto the heat treatment space 65 during the heat treatment of asemiconductor wafer W in the heat treatment apparatus 1. The amount ofnitrogen gas supplied into the heat treatment space 65 is changed asappropriate in accordance with the process steps.

Subsequently, the gate valve 185 is opened to open the transport opening66. A transport robot outside the heat treatment apparatus 1 transportsthe semiconductor wafer W with the nickel film 158 formed thereonthrough the transport opening 66 into the heat treatment space 65 in thechamber 6. The semiconductor wafer W transported into the heat treatmentspace 65 by the transport robot is moved forward to a position lyingimmediately over the holder 7 and is stopped thereat. Then, the pair oftransfer arms 11 of the transfer mechanism 10 is moved horizontally fromthe retracted position to the transfer operation position and is thenmoved upwardly, whereby the lift pins 12 pass through the through holes79 and protrude from the upper surface of the susceptor 74 to receivethe semiconductor wafer W.

After the semiconductor wafer W is placed on the lift pins 12, thetransport robot moves out of the heat treatment space 65, and the gatevalve 185 closes the transport opening 66. Then, the pair of transferarms 11 moves downwardly to transfer the semiconductor wafer W from thetransfer mechanism 10 to the susceptor 74 of the holder 7, so that thesemiconductor wafer W is held in a horizontal position. Thesemiconductor wafer W is held on the susceptor 74 so that a surfacethereof where the nickel film 158 is deposited is the upper surface.Also, the semiconductor wafer W is held inside the five guide pins 76 onthe upper surface of the susceptor 74. The pair of transfer arms 11moved downwardly below the susceptor 74 is moved back to the retractedposition, i.e. to the inside of the recessed portion 62, by thehorizontal movement mechanism 13.

After the semiconductor wafer W is placed and held on the susceptor 74of the holder 7, the 40 halogen lamps HL in the halogen heating part 4turn on simultaneously to start preheating (or assist-heating) (in StepS4). Halogen light emitted from the halogen lamps HL is transmittedthrough the lower chamber window 64 and the susceptor 74 both made ofquartz, and impinges upon the back surface of the semiconductor wafer W.The semiconductor wafer W is irradiated with the halogen light from thehalogen lamps HL, so that the temperature of the semiconductor wafer Wincreases. It should be noted that the transfer arms 11 of the transfermechanism 10, which are retracted to the inside of the recessed portion62, do not become an obstacle to the heating using the halogen lamps HL.

FIG. 13 is a graph showing changes in the temperature of the frontsurface of the semiconductor wafer W. After the semiconductor wafer W istransported into the heat treatment space 65 and is placed on thesusceptor 74, the controller 3 turns on the 40 halogen lamps HL at timet0, so that the temperature of the semiconductor wafer W irradiated withthe halogen light is increased to a preheating temperature T1. Thepreheating temperature T1 is in the range of room temperature to 300°C., and shall be 200° C. in the present preferred embodiment. Thepreheating temperature T1 is not more than 300° C., because thepreheating temperature T1 exceeding 300° C. causes a reaction to occurbetween the nickel film 158 and silicon in the ion implantation region150, resulting in the start of the abnormal lateral growth of nickelsilicide.

The temperature of the semiconductor wafer W is measured with thecontact-type thermometer 130 when the halogen lamps HL performpreheating. Specifically, the contact-type thermometer 130 incorporatinga thermocouple comes through the notch 77 into contact with the lowersurface of the semiconductor wafer W held by the susceptor 74 to measurethe temperature of the semiconductor wafer W which is on the increase.The measured temperature of the semiconductor wafer W is transmitted tothe controller 3. The controller 3 controls the output from the halogenlamps HL while monitoring whether the temperature of the semiconductorwafer W which is on the increase by the irradiation with light from thehalogen lamps HL reaches the predetermined preheating temperature T1 ornot. In other words, the controller 3 effects feedback control of theoutput from the halogen lamps HL, based on the value measured with thecontact-type thermometer 130, so that the temperature of thesemiconductor wafer W is equal to the preheating temperature T1. Itshould be noted that, when the temperature of the semiconductor wafer Wis increased by the irradiation with light from the halogen lamps HL,the temperature is not measured with the radiation thermometer 120. Thisis because the halogen light emitted from the halogen lamps HL entersthe radiation thermometer 120 in the form of disturbance light toobstruct the precise measurement of the temperature.

After the temperature of the semiconductor wafer W reaches thepreheating temperature T1, the controller 3 maintains the temperature ofthe semiconductor wafer W at the preheating temperature T1 for a shorttime. Specifically, at time t1 when the temperature of the semiconductorwafer W measured with the contact-type thermometer 130 reaches thepreheating temperature T1, the controller 3 controls the output from thehalogen lamps HL to maintain the temperature of the semiconductor waferW at approximately the preheating temperature T1.

By performing such preheating using the halogen lamps HL, thetemperature of the entire semiconductor wafer W is uniformly increasedto the preheating temperature T1. In the stage of preheating using thehalogen lamps HL, the semiconductor wafer W shows a tendency to be lowerin temperature in a peripheral portion thereof where heat dissipation isliable to occur than in a central portion thereof. However, the halogenlamps HL in the halogen heating part 4 are disposed at a higher densityin the region opposed to the peripheral portion of the semiconductorwafer W than in the region opposed to the central portion thereof. Thiscauses a greater amount of light to impinge upon the peripheral portionof the semiconductor wafer W where heat dissipation is liable to occur,thereby providing a uniform in-plane temperature distribution of thesemiconductor wafer W in the stage of preheating. Further, the innerperipheral surface of the lower reflective ring 69 mounted to thechamber side portion 61 is provided as a mirror surface. Thus, a greateramount of light is reflected from the inner peripheral surface of thelower reflective ring 69 toward the peripheral portion of thesemiconductor wafer W. This provides a more uniform in-plane temperaturedistribution of the semiconductor wafer W in the stage of preheating.

Next, the flash lamps FL emit a flash of light to perform a heatingtreatment at time t2 when a predetermined time period has elapsed sincethe temperature of the semiconductor wafer W reached the preheatingtemperature T1. It should be noted that a time period required for thetemperature of the semiconductor wafer W at room temperature to reachthe preheating temperature T1 (a time interval between the time t0 andthe time t1) is only on the order of several seconds, and that a timeperiod required between the instant at which the temperature of thesemiconductor wafer W reaches the preheating temperature T1 and theinstant at which the flash lamps FL emit light (a time interval betweenthe time t1 and the time t2) is also only on the order of severalseconds. For flash irradiation from a flash lamp FL, the capacitor 93 ischarged in advance by the power supply unit 95. Then, with the capacitor93 in the charged state, the pulse generator 31 in the controller 3outputs a pulse signal to the IGBT 96 to drive the IGBT 96 on and off.

FIG. 14 is a graph showing an example of a correlation between thewaveform of the pulse signal and a current flowing through a flash lampFL. In the present preferred embodiment, the pulse signal having awaveform as shown in an upper part of FIG. 14 is outputted from thepulse generator 31. The waveform of the pulse signal is specified byinputting from the input part 33 a recipe that is a sequence of definedparameters including a time interval (ON time) equivalent to the pulsewidth and a time interval (OFF time) between pulses. After an operatorinputs such a recipe from the input part 33 to the controller 3, thewaveform setting part 32 in the controller 3 sets a pulse waveformhaving repeated ON and OFF time intervals as shown in the upper part ofFIG. 14 in accordance with the recipe. Pulses PA which are relativelylong in pulse width and short in time intervals therebetween are set inan early part of the pulse waveform shown in the upper part of FIG. 14,and pulses PB which are relatively short in pulse width and long in timeintervals therebetween are set in a late part thereof Then, the pulsegenerator 31 outputs the pulse signal in accordance with the pulsewaveform set by the waveform setting part 32. As a result, the pulsesignal having the waveform as shown in the upper part of FIG. 14 isapplied to the gate of the IGBT 96 to control the driving on and off ofthe IGBT 96. Specifically, the IGBT 96 is on when the pulse signalinputted to the gate of the IGBT 96 is on, and the IGBT 96 is off whenthe pulse signal is off.

In synchronism with the turning on of the pulse signal outputted fromthe pulse generator 31, the controller 3 controls the trigger circuit 97to apply a high voltage (trigger voltage) to the trigger electrode 91.The pulse signal is inputted to the gate of the IGBT 96, with theelectrical charges stored in the capacitor 93, and the high voltage isapplied to the trigger electrode 91 in synchronism with the turning onof the pulse signal, whereby a current flows across the electrodes ofthe glass tube 92 whenever the pulse signal is on. The resultantexcitation of xenon atoms or molecules induces light emission.

The pulse signal having the waveform shown in the upper part of FIG. 14is outputted from the controller 3 to the gate of the IGBT 96, and thehigh voltage is applied to the trigger electrode 91 in synchronism withthe turning on of the pulse signal, whereby a current having a waveformas shown in a lower part of FIG. 14 flows through the circuit includingthe flash lamp FL. Specifically, the value of the current flowing in theglass tube 92 of the flash lamp FL increases when the pulse signalinputted to the gate of the IGBT 96 is on, and decreases when the pulsesignal is off. It should be noted that an individual current waveformcorresponding to each pulse is defined by the constant of the coil 94.

The current having the waveform shown in the lower part of FIG. 14flows, so that the flash lamp FL emits light. The emission output fromthe flash lamp FL is roughly proportional to the current flowing throughthe flash lamp FL. Thus, the output waveform (profile) of the emissionoutput from the flash lamp FL has a pattern as shown in FIG. 15. Thesemiconductor wafer W held by the holder 7 is irradiated with light inaccordance with the output waveform from the flash lamp FL as shown inFIG. 15.

If the flash lamp FL emits light without using the IGBT 96, theelectrical charges stored in the capacitor 93 are consumed momentarilyby emitting light only once, so that the output waveform from the flashlamp FL exhibits a single pulse having a width on the order of 0.1 to 10milliseconds. On the other hand, the IGBT 96 serving as a switchingelement is connected in the circuit and the pulse signal as shown in theupper part of FIG. 14 is outputted to the gate of the IGBT 96 accordingto the present preferred embodiment. Thus, the IGBT 96 intermittentlysupplies the electrical charges from the capacitor 93 to the flash lampFL to control the current flowing to the flash lamp FL. As a result, thelight emission from the flash lamp FL is accordingly chopper-controlled,which allows the electrical charges stored in the capacitor 93 to beconsumed in a divided manner. This enables the flash lamp FL torepeatedly flash on and off in an extremely short time. It should benoted that, before the value of the current reaches exactly zero, thenext pulse is applied to the gate of the IGBT 96 to increase the currentvalue again, as shown in the lower part of FIG. 14. For this reason, theemission output never reaches exactly zero even while the flash lamp FLrepeatedly flashes on and off.

The output waveform of light shown in FIG. 15 may be regarded to showthat two-stage irradiation with light is performed. Specifically, thetwo-stage irradiation includes a first stage of irradiation (firstirradiation) from time t21 at which the flash lamp FL starts emittinglight to time t22 at which the emission output is at its maximum, and asecond stage of irradiation (second irradiation) from the time t22 totime t23 during which the emission output decreases gradually.

More specifically, the pulse generator 31 first intermittently appliesthe pulses PA which are relatively long in pulse width and short in timeintervals therebetween to the gate of the IGBT 96 to cause the IGBT 96to repeatedly turn on and off, whereby a current flows through thecircuit including the flash lamp FL. At this stage, because the pulsesPA which are relatively long in pulse width and short in time intervalstherebetween are applied to the gate of the IGBT 96, the ON time of theIGBT 96 is longer than the OFF time thereof, so that the current flowingthrough the flash lamp FL has a sawtooth waveform which increases asseen in general view (as shown in an early part of the lower part ofFIG. 14). The flash lamp FL through which the current having such awaveform flows performs the first irradiation such that the emissionoutput increases from the time t21 to the time t22.

Next, the pulse generator 31 intermittently applies the pulses PB whichare relatively short in pulse width and long in time intervalstherebetween to the gate of the IGBT 96. At this stage, because thepulses PB which are relatively short in pulse width and long in timeintervals therebetween are applied to the gate of the IGBT 96, the ONtime of the IGBT 96 is shorter than the OFF time thereof in a mannercontrary to the above, so that the current flowing through the flashlamp FL has a sawtooth waveform which decreases gradually as seen ingeneral view (as shown in a late part of the lower part of FIG. 14). Theflash lamp FL through which the current having such a waveform flowsperforms the second irradiation such that the emission output decreasesgradually from the time t22 to the time t23.

By performing the two-stage irradiation with light as shown in FIG. 15on the semiconductor wafer W, the temperature of the front surface ofthe semiconductor wafer W increases from the preheating temperature T1to a target temperature T2, and the temperature profile thereof has apattern as shown in FIG. 16. More specifically, the first irradiationperformed from the time t21 to the time t22 causes the temperature ofthe front surface of the semiconductor wafer W to increase from thepreheating temperature T1 to the target temperature T2 (in Step S5). Thetarget temperature T2 is in the range of 600° C. to 1100° C. where thebase material 111 of silicon and the nickel film 158 react with eachother to form nickel silicide, and shall be 900° C. in the presentpreferred embodiment. The time period from the time t21 to the time t22during which the temperature of the front surface of the semiconductorwafer W is increased by the first irradiation is in the range of 1 to 20milliseconds.

The second irradiation performed from the time t22 to the time t23maintains the temperature of the front surface of the semiconductorwafer W within a ±25° C. range around the target temperature T2 (in StepS6). The time period from the time t22 to the time t23 during which thetemperature of the front surface of the semiconductor wafer W ismaintained within a ±25° C. range around the target temperature T2 is inthe range of 1 to 100 milliseconds. It should be noted that the graph ofFIG. 13 is plotted with a time scale of seconds, whereas the graph ofFIG. 16 is plotted with a time scale of milliseconds. Thus, the timest21 to t23 in FIG. 16 are shown as substantially overlaid on the time t2in FIG. 13.

After the second irradiation using the flash lamp FL is completed, theIGBT 96 turns off to stop the light emission from the flash lamp FL (inStep S7). Then, the temperature of the front surface of thesemiconductor wafer W decreases rapidly from the target temperature T2.Referring again to FIG. 13, the halogen lamps HL turn off at time t3which is a predetermined time period later than the completion of thesecond irradiation (in Step S8). This causes the temperature of thesemiconductor wafer W to start decreasing from the preheatingtemperature T1. At the same time that the halogen lamps HL turn off, theshutter mechanism 2 inserts the shutter plate 21 into the lightshielding position lying between the halogen heating part 4 and thechamber 6. The temperatures of filaments and tube walls of the halogenlamps HL do not decrease immediately after the halogen lamps HL turnoff, but radiant heat is continuously emitted from the filaments and thetube walls at elevated temperature for a short time interval to obstructthe temperature decrease of the semiconductor wafer W. The insertion ofthe shutter plate 21 interrupts the radiant heat emitted from thehalogen lamps HL immediately after the turning off toward the heattreatment space 65 to increase the rate at which the temperature of thesemiconductor wafer W decreases.

The controller 3 monitors whether the temperature of the semiconductorwafer W measured with the contact-type thermometer 130 decreases to apredetermined temperature or not. After the temperature of thesemiconductor wafer W decreases to the predetermined temperature orbelow, the pair of transfer arms 11 of the transfer mechanism 10 ismoved horizontally again from the retracted position to the transferoperation position and is then moved upwardly, whereby the lift pins 12protrude from the upper surface of the susceptor 74 to receive theheat-treated semiconductor wafer W from the susceptor 74. Subsequently,the transport opening 66 which has been closed is opened by the gatevalve 185, and the transport robot outside the heat treatment apparatus1 transports the semiconductor wafer W placed on the lift pins 12 to theoutside (in Step S9). Thus, the heat treatment apparatus 1 completes theheating treatment of the semiconductor wafer W.

In the present preferred embodiment, ions of nitrogen, argon, silicon,germanium and the like are implanted into the source/drain regions inthe semiconductor wafer W to amorphize the ion implantation region 150in the semiconductor wafer W. Then, the nickel film 158 is deposited onthe amorphized ion implantation region 150. The semiconductor wafer Wwith the nickel film 158 deposited thereon in this manner is transportedinto the heat treatment apparatus 1, and is then heated by the flashirradiation from the flash lamps FL.

For the flash irradiation, the first irradiation is initially performedin such a manner that the pulses PA which are relatively long in pulsewidth and short in time intervals therebetween are intermittentlyapplied to the gate of the IGBT 96 whereby the emission output from theflash lamp FL is increased from zero up to a maximum value over a timeperiod in the range of 1 to 20 milliseconds. Such first irradiationcauses the temperature of the front surface of the semiconductor wafer Wto increase from the preheating temperature T1 to the target temperatureT2 for the time period in the range of 1 to 20 milliseconds (in thepresent preferred embodiment, to increase by 700° C.).

By increasing the temperature of the front surface of the semiconductorwafer W to the target temperature T2, amorphous silicon in theamorphized ion implantation region 150 and the nickel film 158 reactwith each other to form nickel silicide. Also, the increase in thetemperature of the front surface of the semiconductor wafer W from thepreheating temperature T1 to the target temperature T2 over a timeperiod not less than 1 millisecond prevents the occurrence ofprocess-induced damage to a device (the gate electrode 115 and the like)formed on the front surface of the semiconductor wafer W. If the timeperiod for which the temperature of the front surface of thesemiconductor wafer W is increased from the preheating temperature T1 tothe target temperature T2 is less than 1 millisecond, there is a dangerthat nickel silicide is not uniformly formed. Also, if the time periodfor which the temperature is increased is less than 1 millisecond,abrupt thermal expansion causes the semiconductor wafer W to becomewarped, so that the distortion applied to the gate and the source/drainregions is changed. As a result, there is a danger that thecharacteristics of devices produced from the semiconductor wafer W aredegraded. On the other hand, if the time period for which thetemperature of the front surface of the semiconductor wafer W isincreased from the preheating temperature T1 to the target temperatureT2 is more than 20 milliseconds, there is apprehension that nickel isexcessively diffused from the nickel film 158 to make the film of nickelsilicide too thick. Also, there is a danger that impurities implantedinto the source/drain regions are diffused deeply to make a junction toodeep. For these reasons, the time period for which the temperature ofthe front surface of the semiconductor wafer W is increased from thepreheating temperature T1 to the target temperature T2 shall be in therange of 1 to 20 milliseconds.

Next, after the temperature of the front surface of the semiconductorwafer W is increased from the preheating temperature T1 to the targettemperature T2, the second irradiation is performed in such a mannerthat the pulses PB which are relatively short in pulse width and long intime intervals therebetween are intermittently applied to the gate ofthe IGBT 96 whereby the emission output from the flash lamp FL isdecreased gradually from the maximum value over a time period in therange of 1 to 100 milliseconds. Such second irradiation maintains thetemperature of the front surface of the semiconductor wafer W within a±25° C. range around the target temperature T2 for the time period inthe range of 1 to 100 milliseconds.

Nickel silicide is grown by maintaining the temperature of the frontsurface of the semiconductor wafer W near the target temperature T2 forthe time period in the range of 1 to 100 milliseconds. FIG. 12 is a viewshowing the growth of nickel silicide. The front surface of thesemiconductor wafer W is heated to near the target temperature T2,whereby nickel silicide 159 grows preferentially in a directionperpendicular to the semiconductor wafer W (in the direction of thethickness of the semiconductor wafer W), as indicated by arrows AR12 inFIG. 12. That is, the nickel silicide 159 grows little in a lateraldirection (toward the gate electrode 115), as compared with that in theperpendicular direction. This results from the fact that theamorphization process in Step S1 amorphizes the ion implantation region150 immediately under the nickel film 158 to make the crystallinity ofthe ion implantation region 150 poorer.

Also, maintaining the temperature of the front surface of thesemiconductor wafer W near the target temperature T2 for the time periodin the range of 1 to 100 milliseconds reduces the point defects 155created near the boundary between amorphous silicon and crystallinesilicon (with reference to FIGS. 10 and 11). If the time period forwhich the temperature of the front surface of the semiconductor wafer Wis maintained within a ±25° C. range around the target temperature T2 isless than 1 millisecond, there is a danger that the point defects 155are not sufficiently reduced. On the other hand, if this time period isgreater than 100 milliseconds, there is a danger that the nickelsilicide 159 grows abnormally also in the lateral direction. The timeperiod in the range of 1 to 100 milliseconds for which the temperatureof the front surface of the semiconductor wafer W is maintained within a±25° C. range around the target temperature T2 allows the formation ofthe nickel silicide 159 in the front surface of the semiconductor waferW while preventing the nickel silicide 159 from abnormally growing inthe lateral direction. Such a time period further reduces the pointdefects 155 introduced in the ion implantation step (Step S1). As aresult, the increase in leakage current is suppressed. For thesereasons, the time period for which the temperature of the front surfaceof the semiconductor wafer W is maintained within a ±25° C. range aroundthe target temperature T2 shall be in the range of 1 to 100milliseconds.

The provision of the temperature maintaining step for maintaining thetemperature of the front surface of the semiconductor wafer W within a±25° C. range around the target temperature T2 for the time period inthe range of 1 to 100 milliseconds facilitates a simulation of heatconduction in the semiconductor wafer W and the like, as compared withan instance where the temperature of the front surface decreasesimmediately after the target temperature T2 is reached. As a result,phenomena resulting from the heating treatment are precisely analyzed.

While the preferred embodiment according to the present invention hasbeen described hereinabove, various modifications of the presentinvention in addition to those described above may be made withoutdeparting from the scope and spirit of the invention. For example, inthe aforementioned preferred embodiment, the temperature of the frontsurface of the semiconductor wafer W is increased from the preheatingtemperature T1 to the target temperature T2 by the first irradiation,and is then maintained near the target temperature T2 by the secondirradiation subsequent to the first irradiation. However, thetemperature maintained by the second irradiation is not limited to thetarget temperature T2. As an example, when the temperature of the frontsurface of the semiconductor wafer W is decreased by 50° C. to 200° C.from the target temperature T2 following a slight time interval afterreaching the target temperature T2, the second irradiation may bestarted to maintain the temperature of the front surface of thesemiconductor wafer W within a ±25° C. range around the decreasedtemperature (a second target temperature).

The nickel film 158 is deposited in Step S2 in the aforementionedpreferred embodiment. In place of the nickel film 158, a film of othermetals for use in silicide technology, e.g. cobalt (Co), titanium (Ti)and tungsten (W), may be deposited on the amorphized ion implantationregion 150.

When a cobalt film is formed in place of the nickel film 158 on the ionimplantation region 150, the preheating temperature T1 is in the rangeof room temperature to 500° C. That is, the cobalt film is capable ofsuppressing the abnormal growth of silicide even when preheated to arelatively high temperature, as compared with the nickel film. Thetarget temperature T2 for the cobalt film is in the range of 600° C. to1100° C. which is similar to that for the nickel film.

When a titanium film is formed in place of the nickel film 158 on theion implantation region 150, the preheating temperature T1 is in therange of room temperature to 500° C. which is similar to that for thecobalt film. The target temperature T2 for the titanium film is in therange of 600° C. to 1100° C. which is similar to that for the nickelfilm.

When a tungsten film is formed in place of the nickel film 158 on theion implantation region 150, the preheating temperature T1 is in therange of room temperature to 700° C. This is because, in the case of thetungsten film, the abnormal growth of silicide does not occur until aconsiderably high temperature is reached. The target temperature T2 forthe tungsten film is in the range of 900° C. to 1100° C.

Also, the process for setting the waveform of the pulse signal is notlimited to inputting the parameters including the pulse width and thelike one by one from the input part 33. For example, the setting of thewaveform may be done by an operator inputting the waveform directly ingraphical form from the input part 33, by reading the waveformpreviously set and stored in a storage part such as a magnetic disk andthe like, or by downloading the waveform from outside the heat treatmentapparatus 1.

Further, although the voltage is applied to the trigger electrode 91 insynchronism with the turning on of the pulse signal in theaforementioned preferred embodiment, the timing of the application ofthe trigger voltage is not limited to this. The trigger voltage may beapplied at fixed time intervals independently of the waveform of thepulse signal. In a case where the pulse signal is short in timeintervals or where the passage of current is started by a pulse whilethe value of the current caused to flow through the flash lamp FL by thepreceding pulse is not less than a predetermined value, the currentcontinues to flow through the flash lamp FL without interruption. Insuch a case, it is not necessary to apply the trigger voltage for eachpulse. In a case where all of the pulse intervals of the pulse signalare shorter than a predetermined value as shown in FIG. 14 according tothe aforementioned preferred embodiment, the trigger voltage may beapplied only when the first pulse is applied. Thereafter, the currentwaveform as shown in the lower part of FIG. 14 is provided only byoutputting the pulse signal as shown in the upper part of FIG. 14 to thegate of the IGBT 96 without the application of the trigger voltage. Inother words, the timing of the application of the trigger voltage may bearbitrarily determined as long as the timing of the current flow throughthe flash lamp FL coincides with the turning on of the pulse signal.

Although the IGBT 96 is used as a switching element in theaforementioned preferred embodiment, another transistor capable ofturning on and off the circuit in accordance with the signal levelinputted to the gate thereof may be used in place of the IGBT 96. It is,however, preferable to use an IGBT and a GTO (gate turn-off) thyristorwhich are suitable for handling high power as a switching elementbecause the emission of light from the flash lamps FL consumesconsiderably high power.

Also, a circuit configuration different from that shown in FIG. 8 may beemployed as long as multi-stage irradiation with light from the flashlamp FL is achieved. For example, a plurality of power supply circuitshaving different coil constants may be connected to a single flash lampFL. Also, as long as the multi-stage irradiation with light is achieved,the light source is not limited to the flash lamp FL, but is requiredonly to be capable of emitting light for not more than 1 second. As anexample, a laser may be used as the light source.

Although the 30 flash lamps FL are provided in the flash heating part 5according to the aforementioned preferred embodiment, the presentinvention is not limited to this. Any number of flash lamps FL may beprovided. The flash lamps FL are not limited to the xenon flash lamps,but may be krypton flash lamps. Also, the number of halogen lamps HLprovided in the halogen heating part 4 is not limited to 40. Any numberof halogen lamps HL may be provided.

Also, in the aforementioned preferred embodiment, the semiconductorwafer W is preheated by irradiating the semiconductor wafer W withhalogen light from the halogen lamps HL. The technique for preheating isnot limited to this, but the semiconductor wafer W may be preheated byplacing the semiconductor wafer W on a hot plate.

Moreover, a substrate to be treated by the heat treatment apparatusaccording to the present invention is not limited to a semiconductorwafer, but may be a glass substrate for use in a flat panel display fora liquid crystal display apparatus and the like, and a substrate for asolar cell.

While the invention has been described in detail, the foregoingdescription is in all aspects illustrative and not restrictive. It isunderstood that numerous other modifications and variations can bedevised without departing from the scope of the invention.

What is claimed is:
 1. A method of heating a substrate of silicon togrow a silicide, said method comprising the steps of: (a) implantingions into said substrate to amorphize an ion implantation region in saidsubstrate; (b) depositing a metal film on the amorphized ionimplantation region; (c) heating said substrate with said metal filmformed thereon at a predetermined preheating temperature; (d)irradiating said substrate with light to increase the temperature of afront surface of said substrate from said preheating temperature to atarget temperature for a time period in the range of 1 to 20milliseconds; and (e) irradiating said substrate with light to maintainthe temperature of the front surface of said substrate within a ±25° C.range around said target temperature for a time period in the range of 1to 100 milliseconds, said step (e) being performed after said step (d).2. The method according to claim 1, wherein: a film of nickel isdeposited in said step (b); said preheating temperature is not greaterthan 300° C.; and said target temperature is in the range of 600° C. to1100° C.
 3. The method according to claim 1, wherein: a film of titaniumis deposited in said step (b); said preheating temperature is notgreater than 500° C.; and said target temperature is in the range of600° C. to 1100° C.
 4. The method according to claim 1, wherein: a filmof cobalt is deposited in said step (b); said preheating temperature isnot greater than 500° C.; and said target temperature is in the range of600° C. to 1100° C.
 5. The method according to claim 1, wherein: a filmof tungsten is deposited in said step (b); said preheating temperatureis not greater than 700° C.; and said target temperature is in the rangeof 900° C. to 1100° C.
 6. The method according to claim 1, wherein saidsubstrate is irradiated with a flash of light from a flash lamp in saidstep (d) and in said step (e).
 7. The method according to claim 1,wherein ions of one element selected from the group consisting ofnitrogen, argon, silicon and germanium are implanted in said step (a).8. The method according to claim 6, wherein a switching elementintermittently supplies electrical charges from a capacitor to saidflash lamp to control an emission output from said flash lamp in saidstep (d) and in said step (e).